A Compliant and Creep Resistant SAC-Al(Ni) Alloy
Published: |
March 27, 2009 |
Author: |
Dr. Benlih Huang, Dr. Hong-Sik Hwang, and Dr. Ning-Cheng Lee; Indium Corporation of America. |
Abstract: |
The Sn-Ag-Cu (SAC) alloys have been considered promising replacements for the lead-containing solders for the microelectronics applications. However, due to the rigidity of the SAC alloys, compared with the Pb-containing alloys, more failures have been found in the drop and high impact applications for the portable electronic devices, such as the personal data assistant (PDA), cellular phone, notebook computer..etc... |
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