01005 Assembly, the AOI route to optimizing yield

Published:

July 15, 2009

Author:

Cathy Combet, Ming-Ming Chang, Product Managers, Vi TECHNOLOGY, France.

Abstract:

The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines. With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005....

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Company Information:

Vi TECHNOLOGY is a worldwide global supplier of a wide range of innovative Automated Inspection AOI, 3D-SPI equipment and software solutions that provide real time data collection and correlation across the SMT line.

Richardson, Texas, USA

Manufacturer

  • Phone 972-235-1170
  • Fax 972-235-1171

See Company Website »

Company Postings:

(6) products in the catalog

(3) technical library articles

(70) news releases

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Voidless Reflow Soldering

Industry 4.0 Reflow Oven