Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies

Published:

January 21, 2009

Author:

Dirk Ellis

Abstract:

This paper describes a new approach to drying circuit board assemblies that significantly reduces the cost of ownership of an aqueous cleaning system. Drying performance is increased through a hybrid drying process that reduces energy input, exhaust requirements and sound levels. The combination of high temperature blow-off and convection brings the flexibility to tailor drying performance to fit the product's drying requirements....

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Company Information:

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

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  • Phone 5085414749
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