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Recommendations for Board Assembly of Infineon Thin Small Discrete Packages without Leads

Published:

April 1, 2021

Author:

Infineon Technologies AG

Abstract:

This document provides information about the Surface Mount Technology (SMT) board assembly of Infineon Thin Small Non-leaded Packages (TSNP). The specific dimensions of the leadframe based inner setup depend on the size of the chip and the type of bonding. The field of application ranges from linear voltage regulators for weight-limited applications such as cellular phones and digital cameras to linear voltage regulators for the automotive sector....

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Company Information:

Infineon Technologies AG

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon are the key to a better future. In the 2020 fiscal year (ending 30 September), Infineon

Neubiberg, Germany

Manufacturer of Components

  • Phone +49 89 234 65555

Infineon Technologies AG website

Company Postings:

(1) technical library article

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