ASMPT LED High Precision Die Bonder Photon Pro

Model:	ASMPT LED High Precision Die Bonder Photon Pro
Category:	Semiconductor & Solar
Model Year:	2023
Condition:	new
Location:	China
Offered by:	SHENZHEN TOPQUALITY INDUSTRY & EQUIPMENT LTD.,
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Features Patented look-through pattern recognition technology High precision bonding XY placement: ± 3 µm @ 3σ Die rotation: ± 0.1° @ 3σ Large substrate handling, max 200 mm x 215 mm substrate size Enhance material traceability by using OCR Multi-chip bonding capability Auto bond-tool change, up to 10 bond-tool buffers Auto wafer change, up to 6 x 6" OD Foton Ring with 2-stage ejector system High flexibility options to fulfill the requirements of diverse multi-chip packages