Aluminum Wedge Bonding AB589

Model:	Aluminum Wedge Bonding AB589
Category:	Semiconductor & Solar
Model Year:	2021
Condition:	new
Location:	China
Offered by:	SHENZHEN TOPQUALITY INDUSTRY & EQUIPMENT LTD.,
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Features High speed wire bonding: 6.5 wires/sec Fine pitch capability: 55 µm x 65 µm Innovative PR technology: PR On The Fly Shorten alignment time Latest rotary bond head design enhancing stability and reliability Extra large effective bonding area: 8" x 6" Supporting various workholder design for full range application Saving human resources Capable to handle raw PCB, vertical integrating the production material capability of the entire production line Saving time of manual load/unload, simplify the bonding, testing and packaging processes AB589-H Automatic material handling capability (option) Gold wire wedge bonding capability (option) Deep access bonding capability 45° bonding angle (option)