PARMI PARMI SPI SPIHS60 MACHINE

PARMI/SPI SPIHS60 MACHINE

PARMI HS60 (supreme) solder paste thickness tester SPI
The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is 100cm2/sec, and the measurement speed at a resolution of 10x10um is 80cm2/sec. It can inspect pads smaller than 01005 and sizes as small as 100um. Based on the RSC-6 sensor developed by PARMI, the HS60 detection cycle time is greatly reduced. In addition, the camera lens used for the RSC sensor has two magnifications-0.42x to 0.6x magnification, giving engineers more control. Main features of the 3D sensor "RSC VI"
· Best speed and best resolution
· 100?/sec @ 13x13um spatial resolution and RSC VI
· 80?/sec @ 10x10um spatial resolution and RSC VI
· Double laser projection without shadow
· Real-time PCB warpage tracking and warp measurement
· Real 3D shapes and colorful 2D images
HS60(supreme) Maximum measuring board 390*260MM
Hs60L(supreme) Maximum measuring board 550*510MM
Stable operation and long life
The PARMI laser head is mounted on a linear motor to provide smooth continuous movement and higher stability, eliminating the impact of vibration on the accuracy of measuring height, area, volume and warpage. This is in contrast to other systems on the market that use stepper motors and "stop/rotate" motion functions that cause vibration and inaccurate results due to rapid acceleration and rapid braking. Due to the stable movement of the laser head, the PARMI linear motor has a longer life

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