Vi Technology 4000L

Model:	Vi Technology 4000L
Category:	SPI / Solder Paste Inspection
Model Year:	2009
Condition:	used
Location:	South Carolina, USA
Offered by:	LEL Tech
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Vi Technology 3D SPI
3D Solder Paste Inspection System
Model: 4000L 3D SPI
Year: 2009
Accuracy and warp compensation
Unmatched true resolution, accuracy and repeatability
Full-featured absolute measurement of the full board surface, mapping to 0.1µm for every measurement
Zero % shadow effect with the structured double light source providing no volume measurement error
True volume measurement of board and paste
Unique flexible board process measurement
Easy operation
Easy off-line programming by automatic conversion of Gerber and CAD Data
Easy- to-use, highly flexible software
On-machine defect review and trend analysis
Real-time process monitoring and alarm signal generation
Real-time SPC software for process monitoring and defect analysis
Full-featured historical drill down of data with intuitive presentation of information
Maximum board dimensions 510 [20] x 460 [18]
Board thickness (minimum to maximum) 0.4 to 5 mm [0.01 to 0.19]
Clearance under camera 25 [0.98]
Clearance under board 25 [0.98]
Clamping system edge 3 [0.12]
PCB warpage Maximum ± 3.5 [0.13]
System accuracy and repeatability (measurement at 21°C ±- 1°C)
Measurement repeatability (3 s)
Height: < 1.5 µm at standard certification target
Volume: < 2 % at standard certification target
Measurement accuracy Height: < 3 µm at standard certification target
Measurement resolution Height: 0.1 µm
Area: 20 µm
% Gage R&R < 10%
Average inspection speed
Inspection speed 20 cm2/sec (without shadow effect)
Inspection items
Inspection items Height, volume, shape, area, bridge, position
Measurable object size Length: 160 ~ 30 000 µm
Height: 50 ~ 500 µm
Machine Dimensions (W x D x H):  1000 x 1250 x 1490 mm (40" x 50" x 59")
Weight:  1080 kg

Jake@lelsemi.com