ASM Siemens SIPLACE CA
Model: |
ASM Siemens SIPLACE CA |
Category: |
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Model Year: |
2021 |
Condition: |
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Location: |
Guangdong, China |
Offered by: |
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| Contact Supplier |
Make: ASM
Model:ASM SIPLACE CA
Details:
1. High-Speed Placement Capability
SMT component placement speed up to 76,000 components per hour (Cph).
Flip chip placement from wafer up to 40,000 Cph.
Die attach placement from wafer up to 50,000 Cph.
2. Placement Accuracy
Placement accuracy up to 10 μm @ 3 σ, ensuring high precision component placement.
3. Hybrid Platform
One machine completes the assembly of wafer and SMT components, integrating complex die bonding processes into the SMT production line.
4. Flexibility
The wafer exchange system can handle up to 50 different wafers, with a switch time of only 6.5 seconds.
5. Cost Savings
Direct placement from the wafer eliminates the cost of tape materials and their storage and handling, offering significant cost savings and sustainability.
6. Size Compatibility
Supports wafers from 4 inches to 12 inches, and supports both face-up and flip-chip placement processes.
7. Environmental Protection and Sustainability
Processing chips directly from diced wafers reduces tape waste, enhancing production sustainability.
8. Comprehensive Tracing Capability
Provides comprehensive single-die-level tracing capability, automatically recording the pick-up position of each die and its placement position on the circuit board.
9. Software Integration
SIPLACE software offers fast programming and line changes, placement programs are portable to any similar machine, and can perform rapid comprehensive substrate map analysis.
10. Interfaces and Automation
- Provides IPC-CFX open communication standard interface, ensuring seamless data communication during chip processing, fully integrated into open automation.
Condition: USED
Location & Shipping: CHINA / FOB Origin
If you want to know more about this machine,feel free to contact me.
Email:smt@smtpark.com
Whatsapp:+86 19924578527(Linna)
Company Information:
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