Yamaha YV100XGP

Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high as 16200CPH (equivalent to 0.22 seconds/CHIP) Mount 0603 components, the whole process accuracy is up to ±50 microns, the whole process repeatability is up to ±30 microns A wide range of applications, from 0201 (imperial) micro components to 31mmQFP large components can be applied Continuously identify all solder balls for CSP/BGA components, including judging whether the solder balls are defective or not Use 2 high-resolution multi-vision digital cameras Optional flying nozzle head with YAMAHA patent, which can effectively reduce machine idling loss The Y-axis is driven by high-power servos and high-rigidity screw rods at the left and right ends. This newly developed fully fixed dual-drive technology improves acceleration and drives through coordinated synchronization at both ends, improves the acceleration function, and shortens Positioning time. Substrate size M type: L460*W335(MAX)-L50*W50(MIN) L type: L460*W440(MAX)-L50*W50(MIN) Mounting accuracy: absolute accuracy (μ+3σ): ±0.05mm/chip, ±0.05mm/QFP Mounting speed: 0.18 seconds/CHIP 1.7 seconds/QFP, 1608/CHIP: 16200CPH Mountable components: 0603-31mm components, SOP/SOJ/QFP/connectors/PLCC/CSP/BGA Dimensions: 1650*1408*1900 Host weight: 1600KG

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