♣ IN-Like New Condition, Only Used Twice ♣
◘ Split-Vision Optics with 1.3 Million Pixel HD Video
Camera, Electronic Zoom Adjustment, and LED Lighting, Projects Superimposed Images of Component Leads and PCB Pads on 15" Full Color LCD Display.
◘ Independent and Fully Programmable Top and Bottom Hot Air Heating, Essential for BGA and CSP Rework, Controlled by High-Quality Siemens PLC and Temperature Control Module.
◘ Thermal Profiles Divisible Into As Many As Eight Segments for Both Top and Bottom Heating with Programmable Heating Rate, Target Temperature, Dwell Time, and Cooling.
◘ Automated Z Axis Motion with Optoelectronic Vertical Height Sensing for Controlled Desoldering, Lift, Placement, and Resoldering of Delicate SMDs.
◘ Auto-Pickup of SMDs from Component Presentation Nest, and Auto-Positioning of Split-Vision Optics Between Component and PCB Pads, Reduces Cycle Time and Protects Delicate Devices from Handling Damage.
◘ Ultra-Fine Micrometer Adjustments in X, Y, and Theta Axes for Fast, Easy, and Precise Alignment of Component Leads to PCB Pads.
◘ 6-Zone IR Underheater with Programmable Power Settings Eliminates Steep Thermal Gradients Across PCB Surface and Prevents Board Warpage and Stress on Adjacent Components and Solder Joints.
◘ High-Efficiency, Rapid IR Heating Technology Reduces Cycle Times and Increases Throughput.
◘ Profile Parameters Include Control of Internal Blower That Provides Lateral Air Flow Across the PCB Surface for Controlled Cooldown Function.
◘ Touch-Screen User Interface with Five Integrated Thermocouple Inputs and Real-Time Temperature Recording Allows On-the-Fly Parameter Adjustment and Simplified Profiling.
◘ Password-Protected User Privileges Separate Operator and Administrative Control Functions.
◘ Software Provides Profile Analysis and Screen Printing Functions via USB Port for Job/Lot Traceability.
◘ On-Board Storage Capacity for Thousands of Leaded and Lead-Free Soldering and Desoldering Profile Parameter Sets for a Multitude of Surface Mount Rework Applications. ◘ Fully Adjustable PCB Holder Accepts Large, Oversized PCBs Up To 550 mm x 500 mm (21.6" x 19.7") and Includes Adjustable Bottom-Side Support Rails.
◘ Convenient Laser Pointer Allows Quick and Easy Positioning of Component/PCB Inline Between Top and Bottom Heater Nozzles.
◘ Full Range of Heater Nozzles Available to Solder/Desolder Components from 3 mm x 3 mm to 80 mm x 80 mm (0.12" x 0.12" to 3.15" x 3.15")
◘ Internal Pump, Vacuum Generator, and Full Set of Vacuum Pick-Up Nozzles Included...No External Compressed Air or Vacuum Needed.
Items included:
◘ Top Nozzles QTY: 9 3x3/2, 6x6/3, 7x7, 12x12, 15x15 and 20x20
◘ Bottom Nozzles 35x35 and 59x59
Stencils: QTY 33 all different size.
◘ Re-balling Kit
◘ Thermalcouple: Qty 5 K type
◘ Two Heating elements, One Top one Bottom.
◘ Alignment tools
◘ User Manual and a high temperature cloth.
ID 111110
Manncorp BR790-HD BGA Rework Station
