Saki BF-Planet-X

SAKY BF-PLANET-X

With a superior resolution of 10μm and scanning line color CCD
camera, both AOI system provide accurate and stable inspection
results. Solder fillets on components as small as the high density
mounted 01005(0402) chip, as well as IC’s with 0.4mm pitch lead are
easily inspected and analyzed.

Board Size 50×60 - 250×330mm, 2×2.4 - 10×13in
Board Thickness 0.6 - 2.5mm, 24 - 100mils
Board Warp +/-2mm, 79mils
PCB Clearance Top: 20mm, 0.8in Bottom: 30mm, 1.2in
Rotated Component Support Available for 0 - 359°rotation (unit of 1°)
Inspection
Categories
Presence/Absence, Misalignment,
Tomb stone, Reverse, Polarity, Bridge,
Foreign material, Absence of solder,
Insufficient solder, Lifted lead, Lifted Chip,
and Fillet defect. Each defect name can be
changed freely by system function.
Scanning Time Approx. 23sec. (250×330mm)
Calculating Time *Approx. 3 sec./10,000 inspection windows
PCB Loading /
Unloading Time
Approx. 3 sec.
Resolution 10μm
Camera (Image Processing) Line color CCD camera
Lighting LED lighting system
Transfer Conveyor Method Round belt transfer
Transfer Conveyor Height 900+/-20mm, 36+/-0.8in
Transfer Conveyor
Width Adjustment
Manual
Operating System Windows XP English Version
System Option BF-RP1 / BF-Editor / BF-Monitor / BF-View
Option 2D Barcode Recognition, Journal Printer
Electric Power
Requirement
Single Phase ～100 - 120V / 200 - 240V +/-10%,
50/60Hz, 500VA
Air Requirement 0.5MPa, 5L/min (ANR), 73PSI, 0.18CFM
Usage
Environment
15°C(59F) - 30°C(86F) / 15 - 80% RH
(Non-condensing)
Dimensions
W x D x H
600 × 915 × 1515mm
24 × 36 × 60in
Weight Approx. 300kg, 660lbs