Oct 03, 2009 
The PRO 100 PPi has been especially designed to work with Reactive Nano Technologies foil to pick and place both foils pieces and components (LEDs), then bond them through a pressure / electrical pluse process. This system has been designed for stand-alone / batch manufacturing and incorporates a precision overhead gantry system with full vision capabilities
The advanced Windows-based control software with integrated gray center vision system facilitates fast, easy programming of pick-up and placement coordinates via the teaching camera, although numeric PCB data can also be entered manually or via a universal CAD conversion utility.
In Program Mode, the software also includes a post-placement inspection function that allows set up engineers to step through the program to verify that placements on assembled boards are within pre-set tolerances stored in the component library.
RNT’s patented NanoFoil® is a new class of nano-engineered material. It is fabricated at our Hunt Valley facility, by vapor-depositing thousands of alternating nanoscale layers of Aluminum (Al) and Nickel (Ni).
When activated by a small pulse of local energy from electrical, optical or thermal sources, the foil reacts to precisely deliver localized heat up to temperatures of 1500°C in fractions (thousandths) of a second.
RNT’s NanoBond® is a proven method for soldering
High Brightness LEDs to PCBs and Metal Core PCBs
(MCPCB). Using this assembly method, the HB LED
component is exposed to much lower process temperatures as compared to traditional or lead free (260ºC) reflow.
Solder attach at low temperatures has been shown to improve HB LED brightness and lifetime.
LED Soldering Advantages:
• Higher Brightness
• Longer Lifetime
• 6-10x Lower Thermal Resistance than Adhesives
• Low Process Temperature for LED Component
• Lead Free
• RoHS Compliant Material
For more information about PROMATION and the PRO 100 PPi system, please contact us at (262) 764-4832 or Sales@Pro-mation-Inc.com
