Sep 21, 2019 
BTU International, Inc is pleased to announce that Fred Dimock, Manager of Process Technology, will present during SMTA International. Dimock will present “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data” during the Jump Start - 101 Technical Session, scheduled to take place Tuesday, Sept. 24, 2019 from 10:30 a.m. - 4:15 p.m. in the Show Floor Theater.
This presentation will provide an overview of the vacuum reflow process and explain the reason vacuum reflow is of interest to the electronic assembly industry. Additionally, Dimock will present a report on preliminary data from a void reduction experiment completed at the Universal Instruments Process Laboratory.
Dimock has taught numerous SMTA solder reflow classes and has participated in the 5-45 subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. He wrote the chapter on solder reflow for the ‘Handbook of Electronic Assembly’ and ‘A Guide to SMTA Certification’ by Dr. Lasky and Jim Hall.
Dimock holds an Associate’s Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). He is a long-standing member of the SMTA Technical Committee.
Come meet industry experts and brush up on your technical knowledge. A great primer for students, young professionals, and engineers new to the industry. Six award-winning industry leaders will teach basics and troubleshooting of SMT processes.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please visit www.smta.org
For more information about BTU International, visit www.btu.com.
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
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