May 06, 2011 
The presentation will take place on May 11 from 2:30-3:25 p.m. in booth 1C16, and will feature a discussion about how to lower reflow oven energy costs while keeping profiles within specs.
Engineers frequently are challenged to find ways to reduce manufacturing costs. In the case of an SMT process, these cost saving measures typically focus on identifying less expensive materials and reducing scrap, approaches that often overlook possible improvements in the operating efficiencies of the reflow oven, itself. Dimock’s presentation will highlight some methods and tools that can be used to lower energy costs of the reflow oven while maintaining profiles that are within the solder manufacturer’s reflow specifications.
Dimock is the manager of Process Technology at BTU International. His extensive experience in thermal processing includes positions at Corning, General Electric, and Sylvania. Additionally, he has authored numerous articles on lead-free processing and process control.
BTU International (http://www.btu.com) is a market-leading, global supplier of advanced thermal processing equipment to the alternative energy and electronics assembly markets. BTU’s equipment and expertise are used in the manufacturing of solar cells and nuclear fuel as well as the production of printed circuit board assemblies and semiconductor packaging. BTU has design and manufacturing operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service worldwide.
