Mar 20, 2012 The Annual Pan Pacific Microelectronics Symposium that took place February 14-16, 2012, at the Sheraton Poipu Resort in Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
There was a 10% increase in total attendance since 2011. The demographic breakdown resulted in 61% of attendees from North America, 22% from Asia and 17% from Europe.
Christopher Bailey, Greenwich University, presented the Tuesday night keynote on "EU Electronics Research and Development Direction; Highlights of Framework 7 and Expectations for Framework 8." Wednesday evening featured a keynote presentation by Tetsuro Nishimura, Nihon Superior Co. Ltd., titled "Pushing the Limits of Lead-Free Soldering." Several sessions were organized on the theme of roadmap strategies and industry roadmaps and were well received by attendees.
As rated by the attendees, the Best Presentation Award went to Dr. Kyung Paik, KAIST (South Korea) for his paper titled, “Recent Advances in Anisotropic Conductive Adhesives Technology.”
Technical papers from all sessions are currently featured in the 2012 Pan Pacific Symposium Proceedings available in the SMTA Bookstore at http://www.smta.org/store/book_store.cfm.
Next year the symposium will be held January 22-24, 2013 at the Makena Beach and Golf Resort in Maui, Hawaii. For more information on the Pan Pacific Microelectronics Symposium, contact SMTA administrator JoAnn Stromberg at 952-920-7682 or joann@smta.org.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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