Feb 04, 2015 
The SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Manufacturers of high-reliability electronic systems are having increasing difficulty in obtaining components with termination finishes that meet their needs. Defense, space, and RoHS-excluded users demand a minimum of 3% lead (Pb) in the termination finish to prevent the possibility of tin whisker growth while RoHS-compliant users require a lead-free alloy free of tin whisker risks. Robotic Hot Solder Dip (RHSD) provides the solution by using tightly controlled robotic process steps to remove the existing finish and replace it with a compliant finish.
The US Navy funded a ManTech project (TMTI) to qualify specific RHSD process parameters as a safe, reliable means to fully replace pure tin termination finishes with tin-lead (SnPb) on a variety of electronic components. The components processed under this Navy project included a wide variety of construction styles, including leaded and leadless, plastic, ceramic, metal, glass-sealed, and other variables. A similar process replaces BGA spheres. Mr. Tyler will describe and demonstrate the RHSD process parameters and necessary equipment controls to consistently ensure that 100% of the original finish is completely removed and that the component is not damaged in any way. For those manufacturers needing RoHS compliance, a similar process removes the non-compliant original finish and replaces it with SAC 305 (Tin-Silver-Copper) or other lead free alloys.
Donald Tyler is Managing Director at Corfin Industries (Salem, NH). Mr. Tyler is actively involved in industry organizations in the US and abroad focused on eliminating risks from Pb-free electronics. He currently chairs the committee for GEIA-STD-0006 “Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts” and is a primary contributor to the IEC/TS 62647-4 “Process management for avionics – Aerospace and defense electronics systems containing lead-free solder – Part 4: Ball grid array (BGA) re-balling” technical standard with expected release later this year.
The evening is scheduled as follows:
- 5:30-6:30 pm Registration, Networking and Dinner
- 6:30-7:30 pm Presentation: “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler
- 7:30-8:00 pm Q & A
Location:
EIT (Main Building Lunchroom)
108 Carpenter Drive
Sterling, VA 20164
(703) 478-0700
Please join us for this networking, learning and dinner event. The registration fees are $20 for members and $30 for non-members. Any new member that joins the chapter at this event can attend the next chapter meeting for FREE.
To RSVP, please click on the following link:
http://www.smta.org/chapters/rsvp.cfm?BEE_ID=3536&BULK_EMAIL_NO=1
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please visit www.smta.org.
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