Apr 23, 2015 
Metcal is pleased to announce that SMTA China awarded its Applications Manager, Paul Wood, ‘The Best Presentation of Vendor Conference One’ for the presentation titled “Why Non-Contact Array Solder Clean Up is required.” The award was presented during the SMTA China East 2015 Conference Award Presentation Ceremony on April 22, 2015 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Current methods of array pad clean up with soldering tools are becoming difficult for many reasons. PCB thickness in the number of layers is increasing because of component density and component density is increasing due to increased performance demands from consumers.
Wood’s presentation discussed how when the pad size is reduced, the surface area for attachment is less and decreases the amount of pad adhesion to the PCB glass fibers. Additionally, he explained how non-contact is becoming the requirement for pads smaller than .5mm. This is fast becoming an absolute requirement to avoid mechanical pad damage on multilayer applications. Request your copy by e-mail at marketing@metcal.com.
Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. As part of OK International, Metcal’s industry-leading position addressing advanced technology in conduction soldering and rework/repair, has and will continue to broaden to a full electronics bench tool single-source solution. Metcal product lines currently include: hand soldering and desoldering, convection rework products, fume extraction and fluid dispensing tools. For more information, visit www.metcal.com.
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