Jan 17, 2017 The SMTA is pleased to announce the Call for Abstracts for the International Conference on Soldering and Reliability June 6-8, 2017 in Markham, Ontario, Canada. The deadline to submit an abstract is February 28, 2017.
Electronic products, particularly consumer products, have become more complex with greater circuit density and increased functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require designers to work closely with materials, manufacturing, test and quality engineers to reduce the likelihood of failure and maximize the probability achieving the design life in the application.
Starting in 2017 the scope of the conference will be broadened to include the physical design aspects relating to electronics component, product and system reliability, involving such topics as thermal and mechanical design, design for manufacturability, test and signal integrity. The Technical Committee has invited several OEMs and well known vendors to present papers, and plans to organize dedicated design sessions and a workshop. We look forward to increased participation by local companies involved in electronics product design and product realization.
To submit an abstract or for more information, please visit: www.smta.org/icsr .The conference is co-sponsored by the SMTA Toronto Chapter and co-located with the Toronto SMTA Expo. For questions, contact: Jenny Ng, SMTA Conference and Education Manager, 952-920-7682 or jenny@smta.org
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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