Dec 14, 2022 SMTA announced that the program is finalized for the 27th Annual Pan Pacific Microelectronics Symposium. The event will take place from January 30 to February 1, 2023 at the Sheraton Kauai Resort on Kauai, Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Advanced Packaging, Advanced Processing, Advanced Materials, Business Strategies, Reliability and more.
On the afternoon of Monday, January 30, a plenary session will kick off the event followed by a Keynote presentation by Eric R. Fossum, Ph.D., Dartmouth College, titled “Cultivating a Culture of Innovation Should be Easy in a University, Right?”
On Tuesday, January 31, Dan Feliciano, OpEx 90, will deliver the keynote lunch talk on “Benford's Law: Helping to Minimize Financial Fraud, Among Other Things.”
On Wednesday, February 1, Rolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration, will give the lunch keynote on “Advanced Packaging Technologies - Key Enablers for Electronic Systems.”
To conclude the symposium, Shintaro Yamamichi, IBM Japan, will provide his keynote presentation about “Neural Networks and Quantum Computing.”
View the complete program and register at: https://www.smta.org/panpac. Promotional packages are available for companies wishing to gain exposure for their products and services. Please contact Karlie Severinson, karlie@smta.org or +1-952-920-7682, with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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