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SMTA Capital Chapter to Host Technical Webinar on Component Failures Caused by X-Ray Inspection Over Exposure

Feb 16, 2026

The SMTA Capital Chapter is pleased to announce an upcoming technical webinar focused on an increasingly critical reliability risk in modern electronics manufacturing: component failure resulting from overexposure to ionizing radiation during manual X-ray solder joint inspection.

The webinar, titled “Component Failure Resulting from Over Exposure to Ionizing Radiation During Manual X-Ray Solder Joint Inspection,” will take place on Thursday, February 26.

The presentation will be delivered by Michael Brinkley, Electronics Manufacturing Engineer and Documentation Control Manager at Axiom Electronics.

As PCB assembly density continues to increase and component package sizes shrink, manufacturers are increasingly relying on X-ray inspection to evaluate hidden solder joints and other features not accessible through traditional visual inspection methods. While both Manual X-Ray Inspection (MXI) and Automated X-Ray Inspection (AXI) are indispensable tools for ensuring solder joint integrity and process validation, increased inspection demands have also elevated the risk of unintended damage to X-ray-sensitive microelectronic components.

In this technical presentation, Brinkley will walk attendees through a documented failure mode analysis of components damaged due to excessive MXI exposure. The session will cover a detailed design of an experiment used to quantify absorbed radiation dose, along with additional research demonstrating how ionizing radiation exposure during manual inspection can alter semiconductor performance and long-term reliability.

The webinar will conclude with practical, real-world corrective actions that manufacturers can implement to reduce risk and prevent damage to sensitive components during X-ray solder joint inspection, without compromising inspection effectiveness.

This webinar is ideal for electronics manufacturing engineers, quality and reliability professionals, process engineers, and anyone involved in inspection, failure analysis, or advanced packaging.

Register today: https://smta.org/events/EventDetails.aspx?id=2026259&group=225180

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