SMT, PCB Electronics Industry News

Electronics in Harsh Environments Conference Program Announced

Mar 30, 2026

SMTA is proud to announce the 2026 Electronics in Harsh Environments Conference, taking place 19-21 May in Amsterdam, Netherlands. This global conference is a three-day technical event with 25 technical presentations focused on building reliable electronics used in power electronics and harsh environments.

Session Topics Include:

  • Harsh Environmental Conditions, Failure Mechanisms & Design for Reliability

  • Coating Selection & Testing

  • Humid Environmental Conditions: Testing & Simulation

  • Isolation Coordination & Particle Risk Assessment

  • High Voltage Stress Conditions

  • Test Methods & Cleanliness Validation

  • Advanced Materials and Processes

The opening keynote speaker, Vivien Grau, Ph.D., Robert Bosch GmbH, will present “Basics and Mechanisms of Insulation - Influencing Factors on the Lifetime of Electrical Insulation Systems” on Tuesday, 19 May.

Following the keynote, a two-part professional development course will be led by Adrian Kandziora of Volkswagen and David Dudek of Trainalytics. The first session, “Robustness Assessment of Electronic Assemblies via a Newly Developed Condensation Test,” will be followed by the second session, “Beyond the VW Condensation Test – Material and Process Qualification in Accordance with IPC 9202 and IPC 9203”.

Technical presentations will be delivered by leading organizations, including Fraunhofer Institute, Thales Group, ZESTRON Corporation, National Physical Laboratory, Inventec Performance Chemicals, MacDermid Alpha Electronics Solutions, and Indium Corporation, among others.

Registration is available online with early registration pricing in effect until 17 April 2026.

For more information contact Karlie Severinson: harsh@smta.org or +1 (952) 920-7682 or visit https://www.smta.org/harsh.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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