Apr 21, 2003
The Flip Chip and BGA Packaging Technologies Workshop will focus on three topics: Assembly Processes for Flip Chip and BGA, Materials Systems for Area Array Packaging, and Reliability of Flip Chip and BGA Packages and Interconnects.
A highlight of the program will be a keynote address by industry expert Peter Elenius of E&G Technology Partners on What Is or Is Not Driving Flip Chip and Wafer Level Package Adoption.
Presentations, rather than papers, will comprise a workshop format to allow more time for interaction, questions, and answers. The workshop session for each topic will begin with an overview followed by the detailed presentations, which describe state-of-the-art technology and future trends.
This event will also feature SMTA Academy courses and other special events. Check the Academy and Symposia pages of the Education section for full details and current information.
SMTA
www.smta.org
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