May 27, 2003 (February 10-12, 2004, Turtle Bay Resort, Kahuku, Oahu, HI) promotes
international technical interchange and provides a premier forum for
extensive networking among microelectronics professionals and business
leaders throughout the Pacific Basin.
Sponsored by the SMTA, the Pan Pacific Symposium focuses on the critical
business markets and technologies of microelectronic packaging,
interconnection, microsystems, and assembly.
The Program Committee is seeking participants to present recent research
results at the Symposium on any of the following topics:
Business Issues - Economics and Cost Analysis, Manufacturing Strategies,
Environmental Matters, Cross Cultural Management, and Roadmaps.
Packaging - Chip Scale, Ball Grid Array, MCM/SiP, 3-D and Stacked Packages,
Thermal Management, Display Drivers, Flip Chip, RF and Microwave.
Interconnection - Advanced PWBs, Blind and Buried Vias, Co-Fired Ceramics,
Flat Panel Displays, Thin and Thick Film Materials, Shaped Circuits, and
Flex/Flex Rigid.
Markets - Trends and Forecasts, Segmentation, Penetration Strategies,
Technology Drivers, and Characterizations.
Assembly - Component Placement, Materials and Processes, Direct Chip
Attach, Automation Control, Test and Troubleshooting, Repair and Rework.
Microsystems Technology - MEMS/MOESM, Optoelectronics, Sensors, Actuators,
DFX, and Partitioning Strategies.
Abstracts of 500 words should be submitted on-line by August 22, 2003: http://www.smta.org/pan_pac/call_for_papers.cfm
Abstracts may also be submitted to:
JoAnn Stromberg, SMTA
Pan Pacific Microelectronics Symposium
5200 Willson Road, Suite 215
Edina, MN 55424 USA
Phone: 952-920-7682 Fax: 952-926-1819
Email: joann@smta.org
Full manuscripts for the conference proceedings are due November 21,
2003. Papers should be 6-10 pages in length including graphics, and they
should offer non-commercial research results on any of the topics listed above.
The SMTA membership is a network of professionals who build skills, share
practical experience and develop solutions in electronic assembly
technologies and related business operations.
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