Register Now for Design For Manufacturability (DFM) Webinar.

Component packaging technology continues to decrease in size (length, width, thickness), interconnection density per unit area is increasing (thinner PCB�s, smaller lines & spaces), functional performance is increasing (thermal, mechanical, electrical) at the same time as assembly processes are changing to lead-free assembly and other legislated requirements.

Due to these evolutionary changes in technology, many elements in the product design and assembly process can no longer be ignored. This presentation will highlight examples of several elements within the product design process (PCB and assembly), manufacturing tooling design, SMT and PTH assembly, cleaning, SMT and PTH rework, and inspection/test opportunities that may impact process deployment and yield improvement.

If you are interested in attending this webinar, please contact Ryan Flaherty, Director of Communications at the SMTA.