Sep 02, 2008 Electronics assembly manufacturing operations face significant complexities from technical advances and environmental regulations. As manufacturing engineers work to implement lead-free designs, additional cleaning complications occur from the introduction of polymer-based flux residues, miniaturization, high-density, and Z-axis components. Environmental regulations, such as REACH, create a level of transparency and limits on materials that may be used in the manufacturing process. Session 1 speakers offer the audience a high level of expertise and insight into evolving industry standards and regulations.
Dale Lee, of Plexus Corp., is the Session 1 chair. Doug Pauls, of Rockwell Collins and chair of the IPC 5-30 Cleaning and Coating Committee, will make the audience aware of the activities taking place on cleaning handbook revisions, cleanliness assessment, and conformal coating. Dr. Bill Kenyon, 40+ year industry veteran and of Global Centre Consulting, will discuss the current cleaning handbooks and revisions underway. Dr. Ron Lasky, of Indium Corp. and Dartmouth, will discuss the far-reaching REACH, WEEE, and RoHS regulations, and how those legislative actions affect electronics assembly cleaning. Lee Wilmot, of TTM Industries, will discuss VOCs, Waste, and Water Municipalities regulations as they relate to cleaning electronics assemblies.
For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.
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