Sep 20, 2010
Session 1, chaired by Dave Adams of Rockwell Collins, will discuss electronic assembly cleaning processes, which include cleaning agent and equipment integration. With lower component gaps of 2 mils or lower and miniaturization, flux residue fills the gap under the component. Data findings show that flow, pressure and deflective energy are needed to move the cleaning agent to the soil. Low gaps create numerous complex factors for removing all residues. The following presentations will be held during Session 1:
- Linda Woody of Lockheed Martin will discuss the development of in-line aqueous cleaning equipment and process parameters needed for cleaning ultra-low standoff components.
- Gunnar Hafstad of Lockheed Martin will discuss assembly configuration and process design considerations for solvent centrifugal cleaning.
- Mike Konrad of Aqueous Technologies will discuss best practice design criteria for batch aqueous cleaning systems.
- Raymond Adcock and Steve Shoda of BAE Systems will discuss assembly cleaning equipment selection and integration.
A panel discussion will follow the tech papers with the goal of collaborating with audience participants to discuss best practice considerations for cleaning today’s challenging circuit assemblies. Julie Fields of Technical Devices, Curtis Hart of Hart Engineering and Dirk Ellis of Kyzen Corporation will join the speakers as panelists.
For more information about the conference, visit http://www.ipc.org/calendar/2010/cleaning-coating-conference-1110/cleaning-coating1110-full-brochure.htm or http://www.smta.org/education/symposia/symposia.cfm#cleaning
»
.gif)
