May 06, 2011 The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 29, 2011. Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed below.
2012 Pan Pacific Microelectronics Symposium topics include:
- 3D/Heterogeneous Integration
- Emerging Technologies
- Green Electronics
- High Performance Low I/O
- Material Advances
- Reliability
- Health/Prognostics
- Strategic Direction/Industry Roadmaps
Please submit abstracts of 500 words with title and author contact information to JoAnn Stromberg, joann@smta.org, or online at http://smta.org/panpac/call_for_papers.cfm.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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