Jul 04, 2020 KYZEN is pleased to announce its participation in the ONLINE CONFERENCE & EXPO. The event will be broadcasted live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST, showing new products from eight exhibitors, including the KYZEN® E5631 Next Generation Stencil Cleaner.
KYZEN E5631 provides superior and exceptional cleaning of ALL widely used assembly materials. The award-winning stencil cleaner was formulated to operate at low concentrations (<25 percent) while remaining a top performing product. Additionally, E5631 rinses easily and completely thus reducing typical dry time.
KYZEN E5631 is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil, and ultrasonic systems. E5631 was formulated with the worker and environment in mind and is a cost-effective solution that quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints.
Sponsored by Global SMT & Packaging, the ONLINE CONFERENCE & EXPO will feature the latest technical presentations, video booth interviews and special guest appearances. To learn more or to register as a visitor, visit https://app.greenrope.com/users/myteam45084/Media653.html.
For more information about KYZEN, or to ask specific technical cleaning questions, visit www.kyzen.com.
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.
