Mar 20, 2008 Kyzen�s presentation will take place during Session S25 in the Cleaning tract from 1:30-3:30 p.m. The paper, �Engineered Cleaning Fluids Designed for Batch Processing� will be presented by Mike Bixenman, Kyzen�s CTO, on Wednesday, April 2, 2008.
Cleaning remains a vital process in both fabrication and assembly. New material technologies, higher temperatures and denser assemblies all pose challenges to cleaning in today�s environment. This session will discuss the newest materials and processes developed to meet those challenges.
The technical conference held during APEX is known worldwide as one of the finest and most selective in the world. Key industry players will present new research and innovations in the areas of board design and manufacture, and electronics assembly. Additionally, there will be sessions that focus on manufacturing software, backwards compatibility and 3-D packaging as well as the conference�s annual focus on key areas such as soldering, assembly processes, advanced packaging, materials and reliability.
