Mar 09, 2009 
Moore's Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore's Law, high-reliability electronics devices build faster processing speed and memory capacity using increasing smaller platforms. The trend toward highly dense assemblies reduces the spacing between conductors while yielding a larger electronic field. As the industry moves to higher functionality, miniaturization, and lead-free soldering, studies show that cleanliness of the assembly becomes more important. Residues under low standoff components, with gaps less than 2 mil, represent an increasingly difficult cleaning challenge. Collaboration from cleaning equipment and cleaning material companies has led to innovations for improving throughput and complete residue removal under low standoff components. The purpose of the paper is to report both mechanical and chemical innovations that open the process window.
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Kyzen is a leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optics industries. Founded in 1990, Kyzen offers superior cleaning chemistries, technical support, application and analytical services throughout the world. Facilities located in Europe and the USA, Kyzen is a three-time SMT Vision Award winner and all Kyzen products are RoHS compliant.
