May 29, 2009 
Advanced electronic product innovations are moving toward small form factors enabled by convergence of circuit board and advanced packaging technologies. The market drivers for cleaning high-reliability circuit assemblies are performance on-demand, mean time to failure, and signal integrity. As component geometries decrease, the challenge of removing residues under the Z-axis� is increasingly difficult. The research focuses on process integration of the cleaning material and cleaning equipment to remove flux residues trapped under the Z-axis�. This paper will address the problem of removing all entrapped flux residue and offer best in practice procedures for building high-reliability circuit assemblies.
Mike Bixenman, PhD and CTO of Kyzen, has 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Mike holds four earned degrees including a Doctorate in Business Administration.
Kyzen is a leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries. Founded in 1990, Kyzen offers superior cleaning chemistries, technical support, application and analytical services throughout the world. Kyzen has won numerous industry awards for their exceptional products and all products are RoHS compliant. For more information, visit http://www.kyzen.com.
