Apr 19, 2010 
Dr. Mike Bixenman will deliver the talk and discussion about cleaning prior to conformal coating, as well as cleaning under low-profile components in PCB Assembly and microelectronics packaging.
Cleaning flux residues post-soldering has been a high-reliability criterion practiced by assemblers of military, aerospace, automotive, medical devices and other value offerings. Highly dense advanced packages reduce spacing between I/Os and standoff heights. The complexity of removing flux residue increases, while elevating the risk of white residue under low standoff components. To address this concern, matching the cleaning agent to the soil opens the process window. This presentation reports research findings from factorial experimental designs studying cause and effect relationships for removing flux residues under low gap components.
Bixenman is CTO of Kyzen Corp., and current Chairperson of the IPC Cleaning and Alternatives Handbook and IPC/SMTA High Performance Cleaning Symposium.
Kyzen is a leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries. Founded in 1990, Kyzen offers superior cleaning chemistries, technical support, application and analytical services throughout the world. Kyzen has won numerous industry awards for their exceptional products and all products are RoHS compliant. For more information, visit http://www.kyzen.com
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