MRSI Introduces 5 mm Capability at SEMICON West 2001

North Billerica, MA � MRSI has announced it will be introducing 5 micron placement capability for optical applications used for data and telecommunications.The system will be introduced at the SEMICON West trade show in San Jose, California on July 18-20, 2001 and will be configured for eutectic die attach of lasers and photodetectors onto submounts.

Extremely precise placement is achieved with a thermally and mechanically stable platform offering fast settling times and +/- 5 microns (0.0002 inch) or better placement accuracy required for photonic applications. Unique capabilities include a heated assembly station with fast closed-loop temperature ramping and controlled contact force for placing small delicate InP and GaAs die with �no touch� surface and edge features, and small thin preforms.

In making the announcement, Daniel Crowley, Vice President Sales, stated �The optoelectronics market is looking for standard equipment with the combination of high speed and 5 micron accuracy from established suppliers. MRSI will provide that solution.�

MRSI is a leading supplier of dispense and assembly systems for the semiconductor, microelectronics, and electronic packaging industry. For more information, contact MRSI at 101 Billerica Avenue, Building 3, North Billerica, MA 01862-1256, Tel.: 978-667-9449, Fax: 978-667-6109, sales@mrsigroup.com, http://www.mrsigroup.com.