IMAPS Europe Plans Technical Symposium, Exhibition in Cracow

Washington, DC � The International Microelectronics and Packaging Society (IMAPS) has announced the IMAPS Europe Cracow 2002 European Microelectronics, Packaging and Interconnection Symposium With Table Top Exhibition, to be held from 16-18 June 2002, at the Sofitel Hotel, Cracow, Poland. Concurrent with the announcement is a Call for Papers. This symposium is one of the most outstanding European international forums for the presentation and discussion of recent developments and future trends in the field of microelectronic materials, packaging and interconnection. The technical program is planned to include the following key topics, for which papers are sought:

Assembly Technologies (Adhesives, Pb-Free Solders, Surface Mount, Others); Electrical, Thermal and Mechanical Design, Modelling and Simulation; Environmentally-friendly Electronics; Microelectronics - Diagnostics, Quality and Reliability; Microelectronics Applications in Automotive, Space and Military Electronics, Data Processing, Wireless Telecommunication, Medicine and Biotechnology; New Materials (Ceramic, Polymeric, Composites) and Film Technologies; Packaging and Interconnection (HD, Encapsulants, MEMS, Optoelectronics); Passive Components, Passive Integrated Components and Functional MCM Circuits, Sensors and Actuators, Micro Electro Mechanical Systems).

For more information, visit http://www.itme.edu.pl/imaps.cracow2002/. The deadline for abstract submission is 23 November 2001. IMAPS is a society dedicated to the advancement and growth of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the promotion of the Society�s portfolio of technologies. Contact IMAPS at 611 2nd Street, NE, Washington, DC 20002, U.S.A., E-mail: IMAPS@imaps.org.; Tel. 202-548-4001; Fax 202-548-6115; Home Page: http://www.imaps.org.