IMAPS Ceramic Interconnect Initiative (CII) Press Roundtable Scheduled for IMAPS 2001

Baltimore, MD � Advances and challenges in ceramic interconnect technology, and how it impacts the next generation wireless communications technology, will be the focus of a Press Roundtable at IMAPS 2001, the 34th International Symposium on Microelectronics, this coming October 9 - 11, 2001 at the Baltimore Convention Center, Baltimore, MD USA. Sponsored by IMAPS, the CII Press Roundtable will be held on Wednesday, October 10, 2001 in Room 333 at the Baltimore Convention Center, One W. Pratt Street, from 12 noon until 2:00 p.m. Lunch will be served.

Members of the press � Industry trade press and all interested parties in the media � are cordially invited to attend this 2-hour event, which will be hosted by Samuel J. Horowitz, Ph.D., father of the Ceramic Interconnect Initiative (CII) and recent recipient of IMAPS� John A. Wagnon, Jr. Technical Achievement Award for his dedication to IMAPS and thick film and LTCC markets. Sam has worked tirelessly to establish the credibility of the ceramic industry to the global OEM community, and has led in the development of the ceramic technology roadmap, which has had a positive impact on the industry.

�During the past couple of years, � Horowitz says, �Iit has become evident that the industry is beginning to become aware of the important role ceramic interconnects

can play in next generation wireless communications technology. The advent of Internet enabled phones, so called 2 1/2 G handset technology, and reports on the path to 3G wireless communication technology are testimony to this fact. The appearance of Bluetooth and Blue Tooth enabled devices, along with quantum leaps in automotive technology � such as driver information systems, route mapping, collision avoidance, adaptive cruise control, and more all involve ceramic interconnect technology. Technology is moving ahead at an exciting pace, and ceramic interconnect technology is making it happen. This is why this Roundtable is vital and relevant.� Just a few of the many topics that will be addressed at the Roundtable include the following:

What are the new ceramic interconnect technologies impacting high density interconnect?

Will ceramic play a role as clock speed for high speed digital processors exceeds 1 GHz?

What is the role of ceramic interconnect technology in integrated packaging?

How is ceramic interconnect technology changing to meet industry needs for smaller, lighter, faster, more cost-efficient devices?

How does the cost of ceramic interconnects compare to alternative technologies?

What are the growth areas for ceramic interconnects and why?

What new applications will use ceramic interconnect technology in 2002 and beyond?

What are some of the biggest challenges/obstacles (financial, technical) faced by design engineers today? How can ceramic help?

For more information, or to sign up to attend this free roundtable, please contact Samuel J. Horowitz at 919/248-5752, or Michael L. Martel at (401) 254-1473, e-mail mmc@loa.com . IMAPS is a society dedicated to the advancement and growth of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the promotion of the Society�s portfolio of technologies. Contact IMAPS at 611 2nd Street, NE, Washington, DC 20002, U.S.A., E-mail: IMAPS@imaps.org.; Tel. 202-548-4001; Fax 202-548-6115; Home Page: http://www.imaps.org.