International Conference on Advanced Packaging and Systems (ICAPS) 2002 Announced

Washington, DC � The International Microelectronics And Packaging Society (IMAPS) has announced that it will sponsor a new symposium - ICAPS 2002, The International Conference on Advanced Packaging and Systems, scheduled to debut at the Reno Hilton Hotel, Reno, Nevada, March 10-13, 2002.

IMAPS is seeking previously unpublished papers on recent works on appropriate topics. Abstracts of 250-300 word length should be submitted electronically by September 14, 2001, using the online submittal form at: http://www.imaps.org/abstracts.htm. For questions send email to abstracts@imaps.org

Topics for the symposium include the following: Systems Packaging; System Applications; Electrical Design; Harsh Environmental System Design; Regulatory Compliance; Shock and Vibration Thermal Management; Optoelectronic Systems; High Density Packaging; HDP Applications; Design and Test; High Density Substrate; Industry Issues; Optoelectronic Packaging; High Density Interfaces; 3D Packaging; Markets and Infrastructure; Modeling, Analysis and Experimentation Techniques; Emerging Technologies; Reliability; and Design/Software Tools.

General Chair for the event is Timothy G. Lenihan, Ph.D., 951 Reynolds Farm Lane, Longmont, CO 80503-4070 USA, Tel. 303/485-6629, Fax 303/485-3958, E-mail: lenihant@ieee.org. For more information, Contact IMAPS at 611 2nd Street, NE, Washington, DC 20002, U.S.A., E-mail: IMAPS@imaps.org.; Tel. 202-548-4001; Fax 202-548-6115; Home Page: http://www.imaps.org.