Aug 14, 2001
Sponsored by IMAPS, topics for the workshop will include MEMS Vacuum Tooling for Handling Micro-Optics; Advanced MEMS Packaging for Microfluidic Systems Containing Electrical and Mechanical Functionality; Micro-Packaging of COTS MEMS for Remote Monitoring Systems; Benefits of MEMS Wafer Level Packaging; Flip-Chip Hermetic Packaging of RF MEMS; MEMs Future Application Directions; Packaging Integrated MEMS Inertial Sensors; A Laminate Based MEMS Accelerometer; and more.
Packaging and integration of MEMS and related microsystems integrated nano systems is the subject of immense interest to diverse application areas such as micro optical switches, RF, pressure and vibration sensors, gyros, microfluidic devices, bio-MEMS, quantum optical detectors, etc. The subject interests various scientists, engineers, managers and investors striving for advanced and next-generation products and leadership.
The last two successful annual workshops focused on MEMS and related system packaging challenges and broad opportunities. The objective of the current workshop is "application specific" MEMS and related devices and their application specific packaging schemes, unlike IC packaging.
General Chair for the event is Ajay P. Malshe, University of Arkansas/HiDEC-MEEG, Email: apm2@engr.uark.edu; Technical Chairs include Albert Chiou, Steve Anderson, and Timothy G. Lenihan, Ph.D., E-mail: lenihant@ieee.org.
Prospective attendees can learn more about the workshop and register online; visit http://www.imaps.org/calendar.htm. For more information, contact IMAPS at 611 2nd Street, NE, Washington, DC 20002, U.S.A., E-mail: IMAPS@imaps.org.; Tel. 202-548-4001; Fax 202-548-6115; Home Page: http://www.imaps.org.
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