News Releases from Indium Corporation
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422 news releases added by Indium Corporation
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Indium Corporation Launches New Water-Soluble, Halogen-Free Solder Paste
Feb 06, 2019 | Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.
Indium Corporation Actively Engaging Attendees on the 2019 IPC APEX Expo Show Floor
Jan 23, 2019 | Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company’s proven products live on the show floor, as well as an opportunity to meet with their voiding experts, from Jan. 29-31 in San Diego, California, USA.
Indium Corporation Names Silver Quill Award Winners
Jan 16, 2019 | Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.
Indium Corporation Experts Honored with IMAPS 2018 Best Paper Award
Jan 15, 2019 | Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California.
Indium Corporation Experts to Present at Pan Pacific Microelectronics 2019
Jan 12, 2019 | Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics Symposium 2019 (PanPac) in Kauai, Hawaii, USA, Feb. 11-14, 2019.
Indium Corporation Experts to Present at IPC APEX Expo
Jan 08, 2019 | Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.
Indium Corporation’s Mackie to Speak at TechSearch International Workshop
Dec 21, 2018 | Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will share his expertise at a TechSearch International’s workshop on Packaging for Automotive Electronics: Meeting Reliability Challenges for ADAS and Electronic Vehicles, Feb. 12-13, 2019, in Austin, Texas.
Indium Corporation Expert to Present at ELEXCON 2018
Dec 18, 2018 | Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.
Indium Corporation Features Gold Alloy Solder Preforms at SPIE Photonics West
Dec 16, 2018 | Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, Calif.
Indium Corporation’s Vareha-Walsh Presents at Global Minor Metals Trade Association (MMTA) Event in China
Dec 16, 2018 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at the 2018 Global Minor Metals Forum on Nov. 28 in Kunming, Yunnan, China.
Indium Corporation’s Indium10.1HF Solder Paste Wins Mexico Technology Award
Nov 27, 2018 | Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste. The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year.
Indium Corporation to Feature Indium8.9HF Solder Paste at IPC APEX EXPO 2019
Nov 14, 2018 | Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA.
Indium Corporation VP of Technology to Lead Professional Development Course at EPTC 2018
Nov 07, 2018 | Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.
Indium Corporation Experts Honored With Best Paper Award at IMPACT 2018
Oct 27, 2018 | Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.
Indium Corporation to Feature Thermal Interface Materials at Thermal Management Workshop
Oct 25, 2018 | Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.
Indium Corporation’s Vareha-Walsh to Present at Minor Metals Trade Association (MMTA) Event in China
Oct 23, 2018 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her industry knowledge and expertise at Minor Metals Trade Association (MMTA) China Minor Metals Seminar on Nov. 6, in Tsim Sha Tsui East, Hong Kong, China.
Indium Corporation Earns Awards at SMTAi 2018
Oct 22, 2018 | Indium Corporation was recognized at SMTA International 2018 in Rosemont, Ill., with two awards from the Surface Mount Technology Association (SMTA) for their contributions to the industry.
Indium Corporation Expert to Present at IMAPS Autumn Conference in Munich
Oct 15, 2018 | Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.
Indium Corporation to Feature New Solder Paste for Fine Feature Printing at APEX 2018
Dec 19, 2017 | Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.
Indium Corporation’s Vareha-Walsh to Present at International Electronic Recycling Congress (IERC) 2018
Dec 05, 2017 | Indium Corporation’s Donna Vareha-Walsh, Director will share her expertise at the 17th International Electronic Recycling Congress (IERC) 2018 event on Jan. 18 in Salzburg, Austria.
Indium Corporation Logistics Expert Shares Indium Metal Supply and Demand at 2017 Global Minor Metals Forum in China
Dec 03, 2017 | Indium Corporation's Donna Vareha-Walsh, Director, Metals Business Unit, shared insights into the global supply and demand for indium at the 2017 Global Minor Metals Forum on Nov. 29 in Chengdu Qinhuang, China.
Indium Corporation Experts to Present at IEMT–EMAP 2016
Aug 30, 2016 | Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.
Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015
Aug 09, 2016 | The Annual Perfect Quality Award was presented to Ross Berntson, Indium Corporation Executive Vice President, at ON Semiconductor’s Supplier Executive Conference on June 8, in Phoenix, Ariz.
Indium Corporation’s State-of-the-Art Recycling Process Delivers Credit for Solder Pot Dross and Contaminated Solder
Aug 03, 2016 | Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.
Indium Corporation VP of Technology to Host Webtorials May 17 & 19
Apr 26, 2016 | Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will instruct an SMTA Webtorial from 1-2 p.m. on May 17 and 19.
Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland
Apr 22, 2016 | Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.
Indium Corporation Expert Presents at SMTA ICSR 2016
Apr 21, 2016 | Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11 in Toronto, Canada. Sandy-Smith will present How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study. This presentation will include data from several studies that demonstrate how stencil design and reflow profile optimization impacts voiding levels and variation in material comparison testing.
Indium Corporation's New Indium10.2HF Solder Paste Delivers Superior ICT Performance
Apr 12, 2016 | Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.
Indium Corporation’s Lasky to Present at Joint SMTA and IMAPS Meeting
Apr 07, 2016 | Indium Corporation’s Dr. Ron Lasky, Senior Technologist, will present at two upcoming SMTA regional forums: SMTA Intermountain Expo & Tech Forum on April 7 in Boise, Idaho; and SMTA Long Island on April 27 in Islandia, N.Y.
Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™
Apr 06, 2016 | Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.
Indium Corporation Names Hults as Global Accounts Manager
Mar 29, 2016 | Indium Corporation announces the promotion of Tim Hults to Global Accounts Manager.
Indium Corporation’s New Indium10.8HF Solder Paste Technology Exhibits Best-in-Class Non-Wet Open Performance
Mar 23, 2016 | Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Indium Corporation’s New Indium10.8HF Solder Paste Technology Exhibits Best-in-Class Non-Wet Open Performance
Mar 22, 2016 | Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Indium Corporation VP of Technology to Present at SMT Hybrid Packaging
Mar 17, 2016 | Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.
Indium Corporation Receives CIRCUITS ASSEMBLY Service Excellence Award at IPC APEX 2016
Mar 17, 2016 | Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at IPC APEX Expo 2016
Indium Corporation’s Low-Voiding Solder Pastes Featured at IPC APEX 2016
Mar 17, 2016 | Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.
Indium Corporation Products "Live@APEX"
Mar 11, 2016 | Indium Corporation will be running its low-voiding solder products "Live@APEX" in partner booths throughout IPC APEX Expo 2016. "Live@APEX," a joint effort between Indium Corporation and its industry partners, accurately and honestly depicts the performance of the company’s materials in real time. The program places Indium Corporation products into live equipment demonstrations on the APEX show floor.
Indium Corporation's Lim to Present at SEMICON China
Mar 03, 2016 | Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.
Indium Corporation Features 'Power-Safe' NC-SMQ®75 Die-Attach Solder Paste at SEMICON China
Feb 20, 2016 | Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.
Indium Corporation Features Indium3.2HF Pb-Free Water-Soluble Solder Paste at Productronica China
Feb 18, 2016 | Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China.
Indium Corporation Experts to Present at APEX 2016
Feb 16, 2016 | Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.
Indium Corporation Features Heat-Spring® for LED Manufacturing at Strategies in Light
Feb 11, 2016 | Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.
Indium Corporation’s Indium8.9HF Solder Paste Technology Solution to Avoid the Void™
Feb 11, 2016 | Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016
Feb 06, 2016 | Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.
Indium Corporation Expert Presents at SMTA Rocky Mountain
Jan 20, 2016 | Indium Corporation's Brandon Judd, Technical Support Engineer, will present at the Surface Mount Technology Association (SMTA) Rocky Mountain chapter meeting on Jan. 26 at the Mile High Stadium in Denver, Colo.
Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016
Jan 05, 2016 | Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Indium Corporation Features InFORMS® at NEPCON Japan
Dec 13, 2015 | Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.
Indium Corporation Wins Global Technology Award for InFORMS®
Dec 01, 2015 | Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
Indium Corporation’s EZ-Pour® Gallium Trichloride Simplifies Room Temperature Processes
Nov 18, 2015 | Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.
Indium Corporation’s EZ-Pour® Gallium Trichloride Simplifies Room Temperature Processes
Nov 16, 2015 | Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.
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