Jan 29, 2014 
Indium Corporation announces that Glen Thomas has been named Product Manager for PCB Assembly Solder Paste.
Thomas is responsible for managing the company’s entire line of solder paste materials for PCB assembly. He will work closely with the sales, technical support, research and development, manufacturing, and quality teams to ensure the product line best meets the needs of the customers.
Thomas has over 25 years of experience working with printed wiring boards and semiconductor packaging. He has held marketing and applications engineering roles at several companies, including Endicott Interconnect Technology, Kyocera, and IBM. He has also traveled extensively throughout Asia and lived in Japan for two years.
Thomas earned his bachelor’s degree in chemical engineering from the University of Wisconsin and his master’s degree, also in chemical engineering, from Michigan State University.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
