Mar 07, 2014 
Indium Corporation’s Maria Durham, product specialist for semiconductor and advanced assembly materials, will present at the IMAPS Device Packaging conference on Tuesday, March 11 in Scottsdale, Arizona.
Durham’s presentation, Solderability Challenges in Emerging BGA Packages, details the sequence of processes seen in typical BGA assembly and examines the effects of each set of prior processes on the solderability of the final pad.
For more information about Maria’s presentation or to register for the conference, visit www.imaps.org/devicepackaging.
Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor’s degree in Physics and Applied Mathematics from Clarkson University in Potsdam, N.Y. While at Clarkson, she worked as a McNair Scholar performing research in electro-chemical deposition.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, and professional development courses. IMAPS currently has more than 8,000 national and international members. For more information or to register for the event, visit www.imaps.org/devicepackaging.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
