Oct 23, 2014 
Indium Corporation's Aaron Yan, area technical manager - eastern China, will share his expertise at an IPC Seminar on Oct. 29 in Suzhou, China.
Yan's presentation, The Challenge of Solder Paste Application in the Mobile Communication Industry, will discuss the solder paste requirements to address the component miniaturization trend, halogen-free flux activity level demands, and the continuing demand for reliable low-cost, Pb-free alloys.
Yan is responsible for providing technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. Yan has more than 12 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
