NC-SMQ�81 No-Clean Sn-Bi-Ag Solder Paste Offers Pb-Free Low-Temperature Solution for Flexible Circuitry

Utica, NY � Indium Corporation of America (ICA), an innovator in high-performance electronic assembly materials, has announced a unique solution for flexible circuitry assembly and other similar applications that require a low-temperature no-clean solder. Indium Corporation of America�s NC-SMQ�81 Sn-Bi-Ag alloy solder paste is the only commercially available robust No-Clean, Halide-free solder paste designed for thermally-sensitive assembly processes using the eutectic Sn-Bi-Ag alloy. This paste is a moderate residue, air reflow product that has exceptional wetting capabilities ensuring high yields in soldering.

Steve Dowds, Manager, Emerging Technologies for ICA, stated, �Flexible circuitry manufacturers switching to lead-free soldering processes have serious concerns. Flexible circuitry is typically more vulnerable to thermal damage than rigid Printed Circuit Board Assemblies, and most of the new lead-free alloys require even higher temperatures to melt than tin-lead solders do. NC-SMQ�81is the way for flexible circuitry manufacturers to go to lead-free processing without damaging their products.�

In a typical reflow soldering profile (forced convection system), its minimum peak temperature is 170 degrees C. (in order to pass SIR) with a max. temperature of 195 degrees C. Individual profiles will vary slightly with different product assemblies. NC-SMQ�81 meets J-STD-004 and -005 criteria, as well as Bellcore, ANSI/IPC-SF-818/SP-819 and Mil-P-28809 specifications, and accordingly guarantees high reliability performance.

NC-SMQ�81 Solder pastes are made from low-oxide, spherical powder composed of Sn-Bi-Ag and other low temperature alloys. A standard mesh size of �325/+500 (25-45m) is readily available and nonstandard mesh sizes including �400/+635 (20-38m) can be supplied upon request.

The Indium Corporation of America is a leader in technologically advanced electronic assembly materials and global provider of solders, fluxes, inorganic indium compounds and pure indium. For more information, visit http://www.indium.com, or contact the company at 34 Robinson Road, Clinton, NY 13323 USA, Tel.: 315.853.4900, Fax: 315.853.1000.