Feb 11, 2016 
Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.
Indium Corporation’s Heat-Spring® is an interface that provides 86 W/mK of thermal conductivity using a pressure range of only 35-100+ psi.
Heat-Spring® helps Avoid the Void™ in high-power LEDs due to its superior conductivity, ease of use, and improved performance over time as compared to thermal grease alternatives. In addition, Heat-Spring® will not bake out or pump out, thus eliminating the air voids left by inferior greases that can result in thermal failures.
Heat-Spring® is reclaimable and recyclable, and is packaged in custom trays or tape & reel.
Heat-Spring® metal thermal interface material is just one of a wide range of Indium Corporation products for the LED assembly industry – from PCB assembly to die-attach to technology-enabling TIMs – which combine superior performance with ease of placement. This reduces cost, increases first-pass yields, reduces field failures, and optimizes profits.
To learn more about on Heat-Spring®, visit www.indium.com/thermal-interface-materials/heat-spring or visit Indium Corporation at booth 110.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
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