Feb 16, 2016 Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev.
Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.
Dr. Lee will also present High Reliability Performance and Mechanism of Pressureless Sintering of Nano-Ag Paste for Die-Attach during the Nano-Materials (for PCB Fabrication and Component Die-Attach) technical session at 10:30 a.m. on March 17. This presentation discusses a novel silver paste that has been developed without any polymeric inclusion for the pressureless sintering die-attach process. This new paste has been designed to address the challenges of service temperature, thermal conductivity, electrical conductivity, and reliability in die-attach for high-power devices such as IGBT.
Indium Corporation experts will also provide technical leadership for the following panels:
- Eric Bastow, Assistant Technical Manager, will moderate the:
- Solder Paste Development technical session
- Flux Reliability I technical session
- Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will moderate the:
- Flux Specifications Task Group – Standards Development committee meeting
- Flux Reliability II technical session with speaker Eric Bastow
Indium Corporation will also conduct one-on-one meetings on how to Avoid the Void™ to achieve reliability, productivity, and satisfied customers. Experts will be at Indium Corporation’s booth #3028 to discuss unique applications, provide insights, and answer questions From One Engineer To Another®.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Bastow is an SMTA-Certified Process Engineer. He provides technical support for Indium Corporation’s full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, Hanover, NH.
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development, and production to ensure that customers have the best quality and selection of products. She has earned degrees in chemical engineering, with a focus on materials, and German language from the international engineering program at the University of Rhode Island.
To schedule a meeting with Indium Corporation experts in advance, contact Anita Brown, Senior Marketing Communications Manager, via email at abrown@indium.com. For more information at the show, stop by Indium Corporation’s booth #3028, or visit www.indium.com/avoidthevoid.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
