Jun 18, 2020 
Indium Corporation’s Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation’s InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.
Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. An uneven bondline can result in early cracking and solder layer delamination due to stress concentration at the thinner joint areas. In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Vijay will examine how InFORMS®, a reinforced matrix solder composite preform (and patent-pending ribbon), deliver uniform bondline control and enhanced reliability by a factor of 2X while achieving the lowest cost of ownership. A live question and answer session will follow the presentation.
Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform.
To register for Vijay’s webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to ensure Indium Corporation’s security measures don’t filter messages into spam folders. This is a first-come, first-served event.
Vijay is responsible for technology programs and technical support for customers in Europe, Africa, and the Middle East. Previously, he was based in San Jose, California and was responsible for applications support for customers on the North American West Coast. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics with a focus on the use of different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials.
He joined Indium Corporation in 2003 and has more than 20 years of experience in electronics assembly. Vijay has a master’s degree in industrial engineering with a specialization in electronics packaging and manufacturing from the State University of New York, Binghamton. He is a Certified SMT Process Engineer and earned his Six Sigma Green Belt certification from Dartmouth College’s Thayer School of Engineering. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at several industry forums and conferences nationally and internationally.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
