Nov 24, 2021 
Durafuse™ LT, Indium Corporation’s award-winning low-temperature alloy technology, will be the focus of a presentation by Dr. HongWen Zhang at the International Microsystems, Packaging, Assembly and Circuits Technology conference (IMPACT), Dec. 21-23, Taipei, Taiwan.
Low-temperature solders with peak reflow temperatures of 200°C and below have been extensively studied, including the 2017 iNEMI Board and Assembly Roadmap which forecast a 20 percent adoption rate of low-temperature solders for board assembly by 2027. BiSn solders are the leading candidates in these studies, however, the intrinsic brittleness of Bi renders poor drop shock performance and compromised reliability.
In A Novel Lead-Free, Low-Temperature Solder with Excellent Drop Shock Resistance, Dr. Zhang will examine the benefits of Indium Corporation’s Durafuse™ LT, a patent-pending, innovative low-temperature alloy technology that offers enhanced reliability with drop shock performance two orders of magnitude better than Bi-containing solders.
Dr. Zhang is manager of the Alloy Group within Indium Corporation’s Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control the joint’s morphology, thus improving the reliability. On the basis of this technique, the Durafuse™ LT, BiAgX®, and Durafuse™ HT solder systems were invented to meet the market need. He has published more than 20 papers and journal articles. Dr. Zhang received his Ph.D. in materials science and engineering, as well as a master’s degree in mechanical engineering from Michigan Technological University. He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
The IMPACT 2021 Conference— organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA— is the largest gathering of PCB and packaging professionals in Taiwan. This year, the conference will be held Dec. 21-23 at the Taipei Nangang Exhibition Center, in conjunction with TPCA Show 2021. The symposium this year highlights the theme “IMPACT on 5G+”. As 5G coverage rapidly expands around the world, the 5G commercial network enables an array of revolutionary technologies, such as loT, artificial intelligence (AI), edge computing, and wearable devices. Given the foundational infrastructure advancing along with technologies, 5G brings faster speed and connectivity to those using it.
