Feb 10, 2022 
The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporation’s Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment and clip-bond in power device applications. In his presentation, DurafuseTM HT—A Drop-in High-Temperature Lead-Free Solution that Outperforms High-Pb Solders in Power Discrete Applications, Dr. Zhang examines a new formulation of Indium Corporation’s innovative material Durafuse™—a novel design based on a mixed-alloy technology—designed to deliver an Sn-rich HTLF paste, presenting the merits of both constituent alloys. This product, Durafuse™ HT, has shown the feasibility as a drop-in solution to replace high-lead solders for die-attach in power discrete applications by delivering improved performance.
Dr. Zhang is manager of the Alloy Group within Indium Corporation’s Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed-alloy solder technique that combines the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control a joint’s morphology, thus improving the reliability. On the basis of this technique, the Durafuse™ LT, BiAgX®, and Durafuse™ HT solder systems were invented to meet market need. Dr. Zhang has published more than 20 papers and journal articles. He received his Ph.D. in materials science and engineering, as well as a master’s degree in mechanical engineering from Michigan Technological University. He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D, and is a certified SMT Process Engineer.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
The Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. The APEC program addresses a broad range of topics in the use, design, manufacture, and marketing of all kinds of power electronics equipment. The combination of high-quality professional education seminars, a full program of referred papers, and an overflowing exhibit hall consistently provides an invaluable education each year.
