Sep 17, 2002 Amkor has adopted the Ultra CSP� as its standard wafer level package offering. Ultra CSP� is a true wafer level CSP package that incorporates a thin film redistribution process to route the pads to JEDEC / EIAJ standard pitches. Conventional CSP solder bumps are formed on the re-routed pads. Ultra CSP� is designed to utilize industry-standard surface mount assembly and reflow techniques. By using conventional SMT placement equipment and avoiding the need for underfill, the end-user experiences many of the cost benefits associated with other JEDEC standard area array packages.
Amkor's Ultra CSP� is ideal for portable communications and related applications that require a low cost packaging solution with small form factor. Features include: incorporates standard JEDEC / EIAJ pitches and CSP solder ball diameters, compatible with conventional SMT assembly and test techniques, utilizes cost-effective thin film redistribution technologies, back-side laser mark compatible, eutectic and Pb-free solder balls and no need for underfill in many applications.
The die sizes currently available are 7mm sq. 0.5mm pitch with 98 I/O or 7mm sq. 0.4mm pitch with 192 I/O.
