May 31, 2012 
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
Function-rich and environment-adaptable, MAP 3.00 offers in-depth data and analysis capability within a highly versatile software platform that seamlessly integrates with all ECD profiling hardware. MAP 3.00 allows engineering specialists to utilize ECD sensor inputs to ECD M.O.L.E. thermal profilers for operation within a unique Environment, which is attuned to the specific profiling job. The software switches from one application to the next, allowing effortless transitions between wave soldering and reflow processes.
ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software platform and robust hardware functionality, ECD is the thermal profiling choice of engineering professionals worldwide. For more information on ECD and its products, visit www.bakewatch.com | www.ecd.com.
